10x NEW Power IC BQ24747RHDR QFN 28pin Chipset BQ 24747 RHDR

Description

10x NEW Power IC BQ24747RHDR QFN 28pin Chipset BQ 24747 RHDR
Lead solder balls' melting point is 180℃,  210℃-215℃ is the best melting temperature.
Lead Free solder balls' melting point is 217℃,  235℃-245℃ is the best melting temperature.
The temperatures listed above are the chip's solder balls actual temperatures (they are measured by the measuring wire on the BGA machine),but not the temperatures from the BGA rework station's top bottom heat guns.
*If soldering a new Lead solder balls chip with Lead Free temperature curve (profile), it will overheat the new chip.*
*If soldering a new Lead Free solder balls chip with Lead temperature curve (profile), it will not completely melt the lead free solder balls on the new chip.*
please make suer you have advabced soldering skill to solder the chips that you will order from us.
Once it has been used, no return will be accepted. Thanks for your understanding.
Please check before you buy it
All mistaken orders will be charged 15% re-stocking fee
Any problem please call us or send ebay message, we will try our best to serve you, Thank you!
TEL:212-315-1688 (Monday to Friday) 10:30am-6:30pm EST
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